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Cover of Wire Bonding in Microelectronics, 3/E

Wire Bonding in Microelectronics, 3/E

by George Harman

McGraw Hill · 2010

₹2,813

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About this book

Published by McGraw Hill in 2010, Wire Bonding in Microelectronics, 3/E by George Harman runs to 446 pages.

Its main subjects are Semiconductors, Microelectronics, Electronic packaging and Reliability.

Book details

ISBN-13
9780071476232
ISBN-10
0071476237
Author
George Harman
Publisher
McGraw Hill
Published
2010
Edition
3
Pages
446
Language
English
Condition
New
Subject
Reference

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