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Cover of Advanced MEMS Packaging

Advanced MEMS Packaging

by C. S. Premachandran, Chengkuo Lee, John H. Lau, Yu Aibin

McGraw-Hill Professional Pub · 2009

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About this book

Published by McGraw-Hill Professional Pub in 2009, Advanced MEMS Packaging by C. S. Premachandran, Chengkuo Lee & others runs to 552 pages.

Its main subjects are Microelectromechanical systems, Microelectronic packaging and Electronic packaging.

Book details

ISBN-13
9780071626231
ISBN-10
0071626239
Authors
C. S. Premachandran, Chengkuo Lee, John H. Lau, Yu Aibin
Publisher
McGraw-Hill Professional Pub
Published
2009
Pages
552
Language
English
Condition
New
Subject
Reference

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