
Nap
NAP
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Materials for ∗high–density∗ Electronic Packa Ging& Interconnection
by NAP
John Wiley & Sons · 1991
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Published by John Wiley & Sons in 1991, Nap: Materials for ∗high–density∗ Electronic Packa Ging& Interconnection by NAP runs to 154 pages.
Its main subjects are Electronic packaging, Materials and Microelectronic packaging.