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Tsv 3d Rf Integration

High Resistivity Si Interposer Technology

by Yu Feng Jin, Shenglin Ma

Elsevier Science Ltd · 2022

₹13,486

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About this book

Tsv 3d Rf Integration: High Resistivity Si Interposer Technology is written by Yu Feng Jin & Shenglin Ma. This edition from Elsevier Science Ltd (2022) has 260 pages.

Book details

ISBN-13
9780323996020
ISBN-10
0323996027
Authors
Yu Feng Jin, Shenglin Ma
Published
2022
Pages
260
Language
English
Condition
New

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