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Cover of Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments

by Suresh K. Sitaraman, Andrew Eugene Perkins

Springer Nature · 2008

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About this book

Solder Joint Reliability Prediction for Multiple Environments by Suresh K. Sitaraman & Andrew Eugene Perkins is a 192-page book published by Springer Nature in 2008.

Its main subjects are Engineering, Materials, System safety and Electronics.

Book details

ISBN-13
9780387793931
ISBN-10
0387793933
Authors
Suresh K. Sitaraman, Andrew Eugene Perkins
Published
2008
Edition
2009 ed.
Pages
192
Language
English
Condition
New

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