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Cover of Supercharge, Invasion, and Mudcake Growth in Downhole Applications

Supercharge, Invasion, and Mudcake Growth in Downhole Applications

by Wilson Chin, Tao Lu, Xiaofei Qin, Yongren Feng, Yanmin Zhou

Wiley-Scrivener · 2021

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About this book

The book deals with Mining engineering.

Book details

ISBN-13
9781119283324
ISBN-10
1119283329
Authors
Wilson Chin, Tao Lu, Xiaofei Qin, Yongren Feng, Yanmin Zhou
Publisher
Wiley-Scrivener
Published
2021
Edition
1
Pages
528
Language
English
Condition
New
Subject
Science, Tech & Medical