Systematic Design for Optimisation of Pipelined Adcs
João C. Vital, José E. Franca, João Goes
₹11,962
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
by Steffen Kroehnert, Beth Keser
IEEE · 2019
₹14,117
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About this book
Topics covered include Integrated circuits and Electronic packaging.
Book details
- ISBN-13
- 9781119314134
- ISBN-10
- 1119314135
- Authors
- Steffen Kroehnert, Beth Keser
- Publisher
- IEEE
- Published
- 2019
- Edition
- 1
- Pages
- 548
- Language
- English
- Condition
- New
- Subject
- ICs & Chip Design
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