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Cover of Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by Ephraim Suhir

CRC Press · 2021

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About this book

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices is written by Ephraim Suhir. This edition is published by CRC Press (2021).

Its main subjects are Interconnects (Integrated circuit technology), Protection, Solder and soldering and Mechanical properties.

Book details

ISBN-13
9781138624733
ISBN-10
113862473X
Author
Ephraim Suhir
Publisher
CRC Press
Published
2021
Edition
1
Pages
382
Language
English
Condition
New
Subject
Science, Tech & Medical