
Structural Analysis in Microelectronic and Fiber-optic Systems
Ephraim Suhir
₹4,248

CRC Press · 2021
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices is written by Ephraim Suhir. This edition is published by CRC Press (2021).
Its main subjects are Interconnects (Integrated circuit technology), Protection, Solder and soldering and Mechanical properties.