
Implementing iOS and macOS Documents with the Files App
Jesse Feiler
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by EuroSimE (2000 Eindhoven, Netherlands)
Springer-Verlag New York Inc. · 2010
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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is written by Netherlands) EuroSimE (2000 Eindhoven. This edition from Springer-Verlag New York Inc. (2010) has 192 pages.
Its main subjects are Simulation methods, Micromechanics, Congresses and Microelectronics.