Skip to content
Free delivery across IndiaCash on delivery
BooksBajar
Cover of Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

by EuroSimE (2000 Eindhoven, Netherlands)

Springer-Verlag New York Inc. · 2010

₹10,103

Free delivery. Nothing extra to pay at checkout.

  • Delivery in 3–7 days to any serviceable pincode in India, with tracking.
  • Cash on delivery. Pay when the parcel reaches you.
  • 15-day returns. See what qualifies.

About this book

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is written by Netherlands) EuroSimE (2000 Eindhoven. This edition from Springer-Verlag New York Inc. (2010) has 192 pages.

Its main subjects are Simulation methods, Micromechanics, Congresses and Microelectronics.

Book details

ISBN-13
9781441948731
ISBN-10
1441948732
Authors
EuroSimE (2000 Eindhoven, Netherlands)
Published
2010
Edition
Softcover reprint of the original 1st ed. 2000
Pages
192
Language
English
Condition
New

More in Computers & Internet

See all