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Cover of Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices

by X. J. Fan

Springer-Verlag New York Inc. · 2010

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About this book

Published by Springer-Verlag New York Inc. in 2010, Moisture Sensitivity of Plastic Packages of IC Devices by X. J.

The book deals with Materials, Plastics in packaging, Moisture and Integrated circuits.

Book details

ISBN-13
9781441957184
ISBN-10
1441957189
Author
X. J. Fan
Publisher
Springer-Verlag New York Inc.
Published
2010
Edition
2010 ed.
Pages
558
Language
English
Condition
New
Subject
Materials

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