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Cover of The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

by Gerard Kelly

Springer-Verlag New York Inc. · 2012

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About this book

in 2012.

Topics covered include Mechanics, Systems engineering, Computer engineering and Machinery.

Book details

ISBN-13
9781461372769
ISBN-10
1461372763
Author
Gerard Kelly
Publisher
Springer-Verlag New York Inc.
Published
2012
Edition
Softcover reprint of the original 1st ed. 1999
Language
English
Condition
New
Subject
Machinery

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