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Cover of Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging

by Y. C. Lee

Springer-Verlag New York Inc. · 2012

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About this book

Manufacturing Challenges in Electronic Packaging by Y. C. Lee is a 261-page book published by Springer-Verlag New York Inc. in 2012.

The book deals with Engineering, Machinery, Electronic packaging and Manufacturing processes.

Book details

ISBN-13
9781461376590
ISBN-10
1461376599
Author
Y. C. Lee
Published
2012
Edition
Softcover reprint of the original 1st ed. 1998
Pages
261
Language
English
Condition
New
Subject
Machinery
See all