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Cover of Lead Free Solder

Lead Free Solder

Mechanics and Reliability

by John Hock Lye Pang

Springer-Verlag New York Inc. · 2011

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About this book

Lead Free Solder: Mechanics and Reliability by John Hock Lye Pang is a 175-page book published by Springer-Verlag New York Inc. in 2011.

Its main subjects are Lead-free electronics manufacturing processes, Green electronics, Solder and soldering and Manufacturing processes.

Book details

ISBN-13
9781461404620
ISBN-10
1461404622
Author
John Hock Lye Pang
Published
2011
Edition
2012
Pages
175
Language
English
Condition
New

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