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From Microstructures to Reliability
by Tae-kyu Lee, Choong-Un Kim, Hongtao Ma, Thomas R. Bieler
Springer Nature · 2014 · Hardcover
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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability is written by Tae-kyu Lee, Choong-Un Kim & others.
Its main subjects are Solder and soldering and Manufacturing processes.