
Introduction to Digital Wireless Communications
Hong-Chuan Yang
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Materials and Reliability
Woodhead Publishing · 2011
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Electromigration in Thin Films and Electronic Devices: Materials and Reliability is written by Choong-Un Kim. This edition from Woodhead Publishing (2011) has 360 pages. It belongs to the Woodhead Publishing in materials series.
Topics covered include Electrodiffusion, Integrated circuits, Deterioration and Thin films.