Fan-Out Wafer-Level Packaging
John H. Lau
₹11,552
3D IC Integration and Packaging
by John H. Lau
McGraw-Hill Professional Pub · 2015 · Hardcover
₹21,522
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About this book
3D IC Integration and Packaging by John H. Lau is a 458-page hardcover edition published by McGraw-Hill Professional Pub in 2015.
The book deals with Integrated circuits, Electronic packaging, Three-dimensional integrated circuits and Microelectronic packaging.
Book details
- ISBN-13
- 9780071848060
- ISBN-10
- 0071848061
- Author
- John H. Lau
- Publisher
- McGraw-Hill Professional Pub
- Published
- 2015
- Edition
- 1
- Binding
- Hardcover
- Pages
- 458
- Language
- English
- Condition
- New
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