3D IC Integration and Packaging
John H. Lau
₹21,522
Fan-Out Wafer-Level Packaging
by John H. Lau
Springer Verlag, Singapore · 2018 · Hardcover
₹11,552
Free delivery. Nothing extra to pay at checkout.
- Delivery in 3–7 days to any serviceable pincode in India, with tracking.
- Cash on delivery. Pay when the parcel reaches you.
- 15-day returns. See what qualifies.
About this book
Fan-Out Wafer-Level Packaging is written by John H. Lau. This hardcover edition from Springer Verlag, Singapore (2018) has 303 pages.
Its main subjects are Electronic packaging.
Subjects
Book details
- ISBN-13
- 9789811088834
- ISBN-10
- 9811088837
- Author
- John H. Lau
- Publisher
- Springer Verlag, Singapore
- Published
- 2018
- Edition
- 1st ed. 2018
- Binding
- Hardcover
- Pages
- 303
- Language
- English
- Condition
- New
More by John H. Lau and related titles
The Visioneers
W. Patrick McCray
₹2,051
Key Concepts in Chemistry
Rainer Roldan Fiscal
₹7,896
Comparative Hemostasis in Vertebrates
James H. Lewis
₹19,519
Marine Combustion Practice
J. Flack
₹3,335
Ophiolites
R. G. Coleman
₹7,737
Advances in the Practice of Public Investment Management
Joachim Coche Narayan Bulusu, Francisco Rivadeneyra Alejandro Reveiz
₹2,979
Cognitive Pluralism
Steven Horst
₹4,568
Rural Disease Knowledge
Matheus Alves Duarte Da Silva, Christos Lynteris
₹12,052
Optimality Principles in Biology
Robert Rosen
₹8,537
Handbook of Public Communication of Science and Technology
Massimiano Bucchi, Brian Trench
₹2,718
Roll-to-Roll Vacuum Deposition of Barrier Coatings
Charles A. Bishop
₹22,337