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Cover of Semiconductor Packaging

Semiconductor Packaging

Materials Interaction and Reliability

by Andrea Chen, Randy Hsiao-Yu Lo

Taylor & Francis · 2011

₹19,096

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About this book

Semiconductor Packaging: Materials Interaction and Reliability is written by Andrea Chen & Randy Hsiao-Yu Lo. This edition from Taylor & Francis (2011) has 216 pages.

Topics covered include Microelectronic packaging, Semiconductors, Integrated circuits and Semiconductor industry.

Book details

ISBN-13
9781439862056
ISBN-10
1439862052
Authors
Andrea Chen, Randy Hsiao-Yu Lo
Published
2011
Edition
1
Pages
216
Language
English
Condition
New
Subject
Reference
See all