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Cover of Semiconductor Packaging

Semiconductor Packaging

Materials Interaction and Reliability

by Andrea Chen, Randy Hsiao Lo

CRC Press · 2016

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About this book

Semiconductor Packaging: Materials Interaction and Reliability is written by Andrea Chen & Randy Hsiao Lo. This edition from CRC Press (2016) has 216 pages.

The book deals with Microelectronic packaging, Semiconductors, Integrated circuits and Semiconductor industry.

Book details

ISBN-13
9781439862070
ISBN-10
1439862079
Authors
Andrea Chen, Randy Hsiao Lo
Publisher
CRC Press
Published
2016
Pages
216
Language
English
Condition
New
See all