Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Name: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Brand: Springer Nature
SKU: 9783319023779
Price: 7749.00 INR
Availability: InStock

by Brandon Noia, Krishnendu Chakrabarty

Springer Nature · 2013

₹7,749

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About this book

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs is written by Brandon Noia & Krishnendu Chakrabarty. This edition from Springer Nature (2013) has 245 pages.

Its main subjects are Integrated circuits, Engineering and Semiconductors.