
Practical Guide to the Packaging of Electronics
Ali Jamnia
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Thermal and Mechanical Design and Analysis, Third Edition
by Ali Jamnia
CRC Pr I Llc · 2016
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition is written by Ali Jamnia. This edition is published by CRC Pr I Llc (2016).
Its main subjects are Electronic packaging, Mise sous boîtier (Électronique), Electronics and Microelectronics.